Feb 24th 2023 AMD's Reviewers Guide for the Ryzen 9 7950X3D Leaks (133). Aug 4th 2022 Potential Ryzen 7000-series CPU Specs and Pricing Leak, Ryzen 9 7950X Expected to hit 5.7 GHz (277). 
ZEN 3 ARCHITECTURE SERIES
Feb 1st 2023 AMD Ryzen 7000X3D Series Prices Revealed, Available Feb 28 (174). Oct 17th 2022 AMD Cuts Down Ryzen 7000 "Zen 4" Production As Demand Drops Like a Rock (242). Dec 2nd 2022 AMD Readies 16-core, 12-core, and 8-core Ryzen 7000X3D "Zen 4" Processors (153). Jan 5th 2023 AMD Confirms Ryzen 9 7950X3D and 7900X3D Feature 3DV Cache on Only One of the Two Chiplets (164). Apr 24th 2023 AMD Ryzen 7000X3D Processors Prone to Physical Damage with Voltage-assisted Overclocking, Motherboard Vendors Rush BIOS Updates with Voltage Limiters (258). Jan 4th 2023 AMD Ryzen 7000X3D Announced, Claims Total Dominance over Intel "Raptor Lake," Upcoming i9-13900KS Deterred (177). Jun 14th 2022 AMD Releases AGESA V2 1.2.0.7 Microcode to Motherboard Vendors and OEMs (113). With these gains, AMD hopes to make up whatever gaming performance deficit the "Zen 3" microarchitecture has against Intel's "Rocket Lake-S." The first processors implementing 3D Vertical Cache Technology will start arriving by the end of 2021, which means it could very well be the Ryzen 6000 series desktop processors, leaving the Ryzen 7000 series to be based on the 5 nm "Zen 4," on track to a 2022 release. It claims that gaming performance improves by an average of 15%, which is akin to a generational performance impact in and of itself. With it, the total cache amount of the CCD jumps to 100 MB (4 MB L2 caches + 32 MB 元 cache + 64 MB 3D Vertical Cache).ĪMD has made some startling claims as to the performance impact of 3D Vertical Cache Technology. At this point we don't know how the cache hierarchy is changed, whether the 64 MB add-on cache is contiguous with the on-die 元 cache, or whether it's an L4 victim cache to the 元$. 
This cache die sits directly over the region that has the CCD's own 32 MB 元 cache, and the difference in height between the two dies is leveled using structural silicon. AMD has collaborated with TSMC on developing a new die-on-die 3D stacking technology using TSVs (through-silicon vias) and structural silicon substrate, to place a 64 MB SRAM on top of the "Zen 3" CCD, which it calls 3D Vertical Cache. We'll split this piece up into four parts that cover the four major components of the Ryzen 7000 launch: 1) the Zen 4 CPU core, 2) the on-chip I/O die that supports the CPU's non-CPU features and handles internal connectivity, 3) the 600-series chipsets that handle most external connectivity, and 4) the physical AM5 socket that will outlive all of the other components by a few years.AMD CEO Dr Lisa Su, in her Computex 2021 Keynote address detailed what could very well be the "Zen 3+" microarchitecture that's been in the news lately, although the name "Zen 3+" was never used in the keynote address.
This one will focus on all the other changes, including the ones that will be with us long after Ryzen 7000 is old news. One is a look at the actual chips' performance and power efficiency, located here. So we're publishing two Ryzen pieces today. The last time this many things changed at once was back in 2017, when the first-generation Ryzen chips originally launched. The processor architecture is changing, but it's also being accompanied by changes to everything from the chipset to the physical socket that the chips plug into. Further Reading Ryzen 7600X and 7950X review: Zen 4 starts off expensive but impressiveĪMD's Ryzen 7000 launch is bigger than just the processors.
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